Amaoe MT6595 Upper Lower BGA Reballing Stencil For CPU Soldering

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Price:
$4.95 $6.95

Description

Amaoe 0.12mm BGA reballing stencil template MT6595 reball net for phone CPU RAM soldering repair, universal 0.12mm MT6595 upper lower BGA reballing stencil template for mobile phone solder rework station repair, high quality MT6595 CPU RAM BGA stencil reballing IC pins, 0.12mm BGA direct heating template tin plant steel net, MT6595 anti drum-up steel mesh with imported steel material and heat dissipating holes

Amaoe 0.12mm MT6595 Upper Lower BGA Reballing Stencil Template Steel Mesh Net For Mobile Phone CPU Motherboard Soldering Repair

Product Features :
  1. Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
  2. Super thin thickness, just 0.12mm, easy to use.
  3. Professional Tin plant steel mesh for MT6595 universal upper lower layer soldering repair.
  4. Special designed: Heat dissipating holes design.
  5. High quality steel material, can work great with any universal phone repair BGA rework station.
  6. Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .
  7. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Material: Imported Japan Steel Sheet
  • Color: As Pictures Show
  • Type: Amaoe Universal BGA Reballing Template
  • Model Number: For MT6595 Tin Plant Stencil Template
  • Thickness: 0.12mm
  • Design: Heat Dissipating Holes Design
  • 100%: High-Quality
  • Application: for MT6595 Universal Phone Upper Lower BGA Reballing Soldering Repair
  • Unit Type: Piece
  • Suitable for: for General Rework Station
  • Function: for Phone BGA Reballing 

Package included :
  • 1pcs x Amaoe BGA Rebaling Stencil Template

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