Amaoe OPPO R11 SDM660 PM660 CPU BGA Reballing Stencils Kit

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Price:
$2.50 $4.50

Description

Amaoe OPPO R11 SDM660 PM660 CPU BGA reballing stencils template for Oppo mobile phones power IC repair, SDM660 CPU PM660 BGA reballing stencils template for Android Xiaomi Redmi Note 3 VIVO X20 logic board repair tools, BGA reballing stencils template steel mesh for VIVO OPPO Xiaomi Redmi power IC repair net

Amaoe SDM660 CPU PM660 Power IC BGA Reballing Stencils Template Steel Mesh Net For VIVO OPPO R11 Xiaomi Redmi Repair

Product Features :
  1. Amaoe Imported Japan for universal phone BGA stencils template kit
  2. 100% new brand and high quality.
  3. Super thin thickness, just 0.12mm, easy to use.
  4. Special designed: Heat dissipating holes design.
  5. High quality steel material, can work great with any universal phone repair BGA rework station.
  6. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Material: Imported Japan steel sheet
  • Color: As pictures show
  • Thickness: 0.12mm
  • Design: Heat dissipating holes design
  • Unit Type: Piece
  • Suitable for: for general rework station
  • Function: for phone BGA reballing


Package includes :

  • 1pcs x BGA Reballing Stencils

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