AMTECH NC-559-ASM Lead-Free Solder Flux Paste for BGA Welding Repair


Price:
$1.25

Description

AMTECH 10cc NC-559-ASM no-clean solder paste for cell phone PCB BGA soldering repair tools, NC-559-ASM lead-free solder paste flux for mobile phone BGA reballing, lead free solder paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.

AMTECH 10CC NC-559-ASM Solder Paste Flux BGA Lead-free Solder Paste For Mobile Phone PCB Soldering Repair

Description:
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.

Features:
  1. Excellent capacity of solder-stickiness
  2. Excellent Anti-wet Capacity
  3. Widely used on BGA, PGA, CSP packages and flip chip operation
  4. Suitable for multiple PCB reflow
  5. No-clean and Lead free for environmental protection

Specification:
  • Brand: AMTECH
  • Flux Type: NC-559-ASM
  • Volume: 10cc / bottle
  • Color: Yellow
  • Weight: 0.08kg

Package includes:
  • 1pc x NC-559-ASM Solder Flux Solder Paste

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