BGA Reballing Stencil Plate Tin Mesh For iPhone 4 5 6 7 7P 8 X Nand


Option: 4
Price:
$0.65

Description

Full set iPhone BGA reballing stencil template kits set for iPhone 4 4S 5 5C 5S 6 6P 7 7P 8 8P X nand repair tools, Apple iPhone IC Chip BGA solder tin template for iPhone 4-XS MAX, BGA reballing stencils plant tin plate and sik tin steel mesh for iPhone mobile phone repair accessories, iPhone HDD Nand / Baseband / Eeprom IC repair BGA rework reballing stencil template

15pcs Full Set iPhone BGA Stencil Reballing Tenplate Tin Mesh For iPhone 4 4S 5 5C 5S 6 6P 6S 6SP SE 7 7P 8 8P XS MAX Nand Frash Repair

[Optional BGA Stencil ] :
  • Option 1: 4
  • Option 2: 4S
  • Option 3: 5
  • Option 4: 5S
  • Option 5: 5C
  • Option 6: 6
  • Option 7: 6P
  • Option 8: 6S
  • Option 9: 6SP
  • Option 10: 5SE
  • Option 11: 7
  • Option 12: 7P
  • Option 13: 8
  • Option 14: 8P
  • Option 15: X
  • Option 16: XR
  • Option 17: XS
  • Option 18: XS MAX
  • Option 19: 4-X  18pcs - BGA Reballing Stencils for iPhone

iPhone full set BGA tin plate net: pad IC, power IC, font / wifi chip, CPU, NAND Flash Tin net for iPhone 4s 5 5s 6g 6plus 6s 6s plus

Features :
  1. High quality BGA Reballing Stencil Template
  2. Material: Metal
  3. Color: Gold
  4. Thickness: 0.12 mm
  5. Specially designed for iPhone 4 4S 5 5C 5S 6 6P 6S 6SP 7 7P 8 8P SE X XR XS XS MAX
  6. Make your repair work easier

Package included :
  • 1pcs x BGA Stencil Template

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