BGA Reballing Stencil Steel Net For Phone CPU IC Motherboard Repair

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Option: BGA152
Price:
$2.50 $4.50

Description

eMMCP eMCP BGA reballing stencils template steel mesh net for BGA529 BGA152 BGA162 BGA186 BGA221 BGA169 BGA153, eMPC153/16 eMPC162/186 reballing net for phone repair, BGA reballing steel mesh net for mobile phone CPU IC motherboard repair tool, CPU BGA reball reballing stencils net for cellphone repair tools

Phone CPU IC BGA Reballing Stencils Template For BGA152 BGA162 BGA186 BGA221 BGA169 BGA153 Motherboard Soldering Repair

[ Optional BGA Reballing Stencils Net ] :
  • Optional 1: BGA152
  • Optional 2: BGA169 / BGA153 eMPC153/169Optional 3: BGA162 / BGA186
  • eMPC162/186
  • Optional 4: BGA529 eMCP529
  • Optional 5: BGA221 eMCP22

Product Features :
  1. 100% new brand and high quality.
  2. Super thin thickness, easy to use.
  3. Special designed: Heat dissipating holes design.
  4. High quality steel material, can work great with cellphone repair BGA rework station.
  5. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA reballing stencils template
  • 100%: High quality
  • Material: Steel sheet
  • Size: 50mm*50mm
  • Color: As pictures show
  • Unit Type: Piece
  • Suitable: For general rework station
  • Function: For phone BGA reballing

Package includes :
  • 1pcs x BGA Reballing Stencil Net

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