AMAOE Huawei HI Series Power IC BGA Reballing Stencil Heat Template Repair Kit Hi6555 Hi6561 Hi6553 Hi6422
Product Features :
- Amaoe Imported Japan for universal phone BGA reballing stencil template
- 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan Steel Sheet
- Color: As Pictures Show
- Type: Amaoe Universal BGA Reballing Template
- Thickness: 0.12mm
- Design: Heat Dissipating Holes Design
- Application: For Huawei universal phone BGA reballing soldering repair
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil