Huawei MT7 MTS P8 CPU IC BGA Stencils Kit Soldering Template Net

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$2.50 $4.50


Amaoe Huawei MT7 / MTS / P8 - HW:1 BGA reballing stencils template steel mesh for mobile phone CPU BGA motherboard soldering repair plate, PCB HI3630 AI3635 HI6361 HI6402 HI6401 HI651 series CPU chips reballing, BGA reballing stencils kit soldering template kit for Huawei MT7 / MTS / P8 CPU IC chip rework repair tool, high quality BGA reballing stencil dedicate kit for Huawei Android phone motherboard IC chip reballing repair

Huawei MT7 MTS P8 BGA Reballing Stencils Kit Template For Huawei Android Mobile Phone Rework Repair

Product Features :
  1. Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
  2. Super thin thickness, just 0.12mm, easy to use.
  3. Special designed: Heat dissipating holes design.
  4. High quality steel material, can work great with any universal phone repair BGA rework station.
  5. Can work great with any universal phone repair BGA rework station Tin plant net .
  6. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Material: Imported Japan Steel Sheet
  • Color: As Pictures Show
  • Type: Amaoe Universal BGA Reballing Template
  • Thickness: 0.12mm
  • Design: Heat Dissipating Holes Design
  • Unit Type: Piece
  • Suitable for: for General Rework Station
  • Function: for Phone BGA Reballing 

Package includes :
  • 1pcs x BGA Reballing Stencil

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