JC EM01 BGA Grinding Machine for Iphone Motherboard Grinding

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Price:
$2,590 $2,999

Description

JC EM01 Intelligent Grinding Machine for iPhone 6 7 8 X Motherboard BGA Chip IC

Touch screen control panel, this machine is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6 6P 6S 6SP 7, 7P. 8 8P X

- JC-ID EM01 Operation System, intelligent operation, support auto-upgrade software and data file via WIFI

- 10-inch high resolution capacitor touch screen, integrated 720P HDMI camera, all in one screen.

- The First Mini Intelligent Grinding Machine in the communications industry,the structural designed with refinement and high level.

- Working distance: 103cm*175cm*63cm, everything is under control.

- Independent technology, detection chip surface self-built 3D, deformed-motherboard/chip grinding one step in place

- The template designed with two-sided buckle, quick replacement and stable installation.

- The camera designed with a rotating ring for 360 panoramic images shooting

- 800W high-performance spindle motor, high-intensity work without any pressure

- High-precision Straight rail, the precision can be up to 0.01mm,

- Support for electronic handwheel options, plug-and-play, 3-axis operated precisely

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