Mechanic 158℃ Lead-free BGA Solder Flux Paste SMT Soldering Tin Cream



MECHANIC 158℃ lead-free BGA solder flux paste 35g soldering tin cream for phone PCB IC SMT BGA, Mechanic XGS35 no-clean soldering tin cream for phone BGA welding tool, Mechanic 158℃ SMT solder paste flux for phone motherboard repair tool, mainly used in SMT industry PCB surface resistance, capacitance, IC and electronic components welding.

MECHANIC 35g 158℃ Lead-free BGA Solder Flux Paste for Phone PCB Soldering Tin Tool

Special middle tempature soldering paste
Number: 5#
Model: XGS35
Paste: IPX6
G.W: 35g
N.W: 27g
Metling: 158℃
Application: Suitable for most motherboard's components

Package List:  
1pcs x 158℃ Soldering Paste

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