NOTE: BGA-IC adhesive removing liquid, Cos this items is liquid, it is the lis of Prohibited Goods: DHL/UPS/EMS/all air mail, and may not shipped, this items will NOT be accepted for carriage, if you need it, we just send to china address or china express company.
- It can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, Acrylate, polyurethane, organosilicon.
- It does not to harm to circuit board and component, even to maintenance worker.
- iPhone black Glue adhesive solution remover
- Special removal solution for iPhone BGA Chip Black Glue
- Removing liquid softens and removes resinating and Black sealing glue of iphone BGA ICs
How to use:
- Use a tweezers to pick a piece of cotton wool with bigger size to BGA chip and Dip it into the glue remover.
- Put the cotton wool on the BGA chip and cover through
- Place a plastic bag or film on the top and cover the PCB board
- Wait for 20mins.
- REDO step 1 to 4
- Use a tweezers to remove softened sealing glue around the BGA
- Use Hot air gun (300Deg. C) to heat up the chip. The Glue at the bottom will melt and soften by heat
- Use a Tweezers / cutter to remove the chip
Attention: glue removing liquid , it shall not touch skin, eye, please close it after using. If touched by accident, pls use water clean it.
- 1pc x 30ml bottle glue removing liquid
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