Mechanic BGA Reballing Stencil Steel Net For Huawei Xiaomi Soldering

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Option: VS01
Price:
$1.85 $3.85

Description

Mechanic BGA reballing stencils kit solder template steel net for Huawei Xiaomi smartphones soldering repair tools, Mechanic BGA reballing stencil template for Xiaomi China smartphones Emmc Qualcomm IC chip soldering repair tools, Mechanic universal BGA reballing stencil for MTK EMMC for Huawei Xiaomi CPU RAM PM power IC reball pin BGA direct heat template

Mechanic Multi-purpose Stainless Steel BGA Reballing Stencil Template Net For Huawei Xiaomi Android Smartphones Soldering Repair Tools

[ Optional Models ] :
  • Option 1: VS01 - BT Wifi RF series chip
  • Option 2: VS02 - EMMC
  • Option 3: VS03 - Vivo Oppo
  • Option 4: VS04 - 0.3/0.35/0.4/0.5mm
  • Option 5: VS05 - PMIC power IC
  • Option 6: VS06 - Huawei 1
  • Option 7: VS07 - Huawei 2
  • Option 8: VS08 - Huawei 3
  • Option 9: VS09 - Qualcomm Power IC
  • Option 10: VS10 - Vivo X6/X7/X9 Oppo R9P R9S
  • Option 11: VS11 - Qualcomm 845 SDM845
  • Option 12: VS12 - Oppo 1
  • Option 13: VS13 - Oppo 2
  • Option 14: VS14 - MTK 1
  • Option 15: VS15 - MTK 2
  • Option 16: VS16 - MTK CPU
  • Option 17: VS17 - Redmi Note 2/3 MAX MSM8956/MT6795 CPU
  • Option 18: VS18 - Xiaomi 4 Mi 3/SSTE, MSM8274/8674/8974
  • Option 19: VS19 - MT6592/MSM8916/8928 Note2 2A
  • Option 20: VS20 - Redmi Note2 MAX, MSM8956/MT6795 CPU
  • Option 21: VS21 - Redmi Note 4, Redmi Pro, MSM8593, MT6797 CPU
  • Option 22: VS22 - Redmi Note 5 Pro, Note 3 6X 636/660 CPU
  • Option 23: VS23 - Redmi Note 4X, A 4A 5A 5 Plus 2S Pro, 5X/MAX2, MSM8917/8953 CPU
  • Option 24: VS24 - Xiaomi 5 5S Plus Te2/MIX...
  • Option 25: VS25 - Xiaomi 8 MAX 2S, Qualcomm 845 SDM845 CPU

Product Features :
  1. 100% brand new and high quality.
  2. Made of premium metal material, these stencils are durable.
  3. This is a set of different stencils mainly used for iPhone BGA reballing.
  4. High success rate of planting tin, the solder balls can be formed once when you are proficient.
  5. These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
  6. Compatible with: Special for Huawei / Vivo / Oppo / Xiaomi / Redmi

Product Specification :
  • Item Type: BGA Reballing Stencil
  • Material: Stainless steel
  • Size: Standard Size
  • Color: Silver
  • Weight: 0.01kg
  • Suitable Models: For Huawei / Vivo / Oppo / Xiaomi / Redmi

Package included :
  • 1pcs x BGA Stencils Platform

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