MECHANIC High Synthetic BGA Solder Flux Paste Advanced Soldering Paste Flux BGA Soldering Tin Cream for Mobile Phone Motherboard PCB, BGA, SMD Repair
- Option 1: MCN-UV50
- Option 2: MCN-UV80
- High bond strength. PH value neutral, insulation is strong, welding surface smooth
- IC and PCB for no corrosive
- Its boiling point only slightly higher than the melting point of the solder
- For mobile phones, PC cards, BGA, SMD, PGA and other sophisticated electronic chip-level help welding
- Brand: MECHANIC
- Item name: Soldering paste flux
- Model: UV50 / UV80
- Color: Yellow
- Viscosity: 0.2PaS
- Granularity: 0.22um
- Packing: Aluminum box
- Appliance: PCB, BGA, SMD, PGA repair repair
- Wipe the surface of the object before soldering.
- Apply the paste flux to the solder joint.
- Solder the tin to the solder joint with soldering iron.
- 1pc x MECHANIC Soldering Paste Flux