- The BGA flux solder paste is a high viscosity no-clean flux.
- It is the mixture of high-quality alloyed powder and resin paste flux.
- It can avoid the pale yellow residue, so you are easy to clean the board.
- It can be used for PCB, BGA, SMD, PGA reworking.
- It can be used for soldering and reballing of computer and phone chips.
- It is a necessary material for repairing the mobile phone mainboard.
- Help to repair the circuit boards and protect the electronic components.
- Item name: Solder Paste Flux
- Brand: MECHANIC
- Type: XG-Z40
- Material: Tin+solder paste
- Color: As picture shown
- Alloy: Sn63/Pb37
- Microns: 25-45um
- Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
- 1pc x MECHANIC BGA Solder Flux