- Option 1: 10-IN-1 iphone CPU Removal Graver: 10pcs Blade + 1pcs handle
- Option 2: 27-IN-1 iphone CPU Removal Graver: 27pcs Blade + 1pcs handle
- 27-in-1 BGA disassemble blade set is for iPhone A9 A8 A10 A11 Logic Board BGA Chip repair tool kit.
- Specialized iPhone repair tool for CPU blade remove chip edge glue.
- Ultra-thin 0.05mm blade, capricious good, it can ease between the chip and the board at the end, is not easy to lead off point.
- To clean the knife edge position when the demolition glue chip and chip temperature around 200 Vinyl
- Hot air gun to open 150 degrees, 60 pairs of large air speed for 2 minutes to warm up the motherboard
- Hot air gun put a small head, a temperature of 350 degrees to open the first blow of the knife position about 10 seconds and then shake inserted into the bottom of the chip.
[Note: When the knife from side to side is not inserted into the well after the time described the tin melting point not melt easily can be inserted to the knife. ]
- 1pc x Handle
- 10pcs / 27pcs x Blade (New design)
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