MJ Z15 planting platform & iPhone 11 BGA reballing jig fixture soldering platform, it is used for separating, positioning and reballing iPhone 11 logic board, more convenient and faster for reballing BGA without any damage, the iPhone 11 reballing soldering platform will offer you best solution for iPhone PCB layer dissembling / assembling / separating repair test working.
How to use:
- Install the iPhone 11 main board on the platform
- Cover the iPhone 11 BGA reballing stencil on the mainboard
- Evenly spread tin on the cover of the reballing stencil
- Remove the reballing stencil cover
- Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
- 1 x MJ Z15 BGA Soldering Fixture
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