- Used for positioning and reballing iPhone 12/12pro PCB BGA parts
- Convenient and faster for reballing BGA without any damage
- Offer you best solution for iPhone 12/12 pro BGA reballing and repairing.
- Install the iPhone 12/12 pro main board on the platform
- Cover the iPhone 12/12 pro BGA reballing stencil on mainboard
- Evenly spread tin on the cover of the reballing stencil
- Remove the reballing stencil cover
- Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
Package Includes :
- 1pcs x MiJing Z18 BGA Reballing Fixture