MJ CH3 Layered Soldering Platform For IPhone Motherboard Teardown



MJ CH3 Motherboard Layered Soldering Platform for iPhone X Xs Max PCB Teardown


3 in 1 Pre-Heating Station support iphone A11 A12 CPU chip, iPhone X / XS/XS MAX baseband, and glue removal.

Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.

Size: 185*54*29mm (Main Unit) , 160*88*48mm (Thermostat)

Voltage: 100-250V

Package List:

1 x Main Unit
1 x Thermostat
1 x Power Cable

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