MJ CH3 Layered Soldering Platform For IPhone Motherboard Teardown



MJ CH3 Motherboard Layered Soldering Platform for iPhone X XS Max PCB Teardown

Features : 
3 in 1 Pre-Heating Station support iPhone A11 A12 CPU chip, iPhone X / XS/XS MAX baseband, and glue removal.

Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.

Specification :
  • Main Unit Size: 185*54*29mm
  • Thermostat Size: 160*88*48mm
  • Voltage: 100-250V

Package List : 
  • 1pcs x Main Unit
  • 1pcs x Thermostat
  • 1pcs x Power Cable

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