MSM8916 893 8940 CPU IC BGA Reballing Stencils Template Kit For OPPO VIVO Motherboard Soldering Repair Tools
Product Features :
- Amaoe Imported Japan for universal phone BGA stencils template kit
- 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Model: OV: 2
- Material: Imported Japan steel sheet
- Color: As pictures show
- Type: Amaoe universal BGA reballing template
- Thickness: 0.12mm
- Design: Heat dissipating holes design
- Unit Type: Piece
- Suitable for: for general rework station
- Function: for phone BGA reballing
Package includes :
- 1pcs x BGA Reballing Stencils Kit
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