Multi-functional iPhone X PCB soldering / desoldering platform is available for different BGA sockets for iPhone X A11 CPU NAND chips positioning, disassembly, soldering, etc. The cooling high temperature resistant will offer the best assistance to professional iPhone motherboard fix
- The first fixture uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board
- The iPhone X PCB fixture added A11 CPU / LGA80 NAND positioning structure. No manual positioning needed, improve the success rate.
- The iPhone X PCB Test fixture with integrated layer tin planting function. The precision stencils are produced by world's leading laser technology.
- iPhone X PCB holder fixture added motherboard layer separation and positioning installation structure.
- 1pc x Double Layers Cooling Tin Platform
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