PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering

Size: 120C


PHONEFIX Heating Station + 3 kinds Motherboard Heating groove:

120X-MAX ( 3-IN-1 ) for iphone X / XS / XS MAX Double Layers Board Pre-heating Rework Station
120C - for iphone 5 6 7 8 motherboard Desoldering Rework Station
120CC - Android phones motherboard Desoldering pre-Heating Rework Station


Voltage: 110V / 220V
Demolition shield temperature adjustment 180℃-220℃
In addition to CPU side glue temperature 180℃-220℃
Demolition A8 A9 A10 A11CPU the temperature 230℃-240℃
Desmearing temperature 180℃-200℃
Reball BGA chip temperature 180℃-200℃
Soldering A8 A9 A10 A11 CPU temperature 190℃-210℃

Iphone 6 6S 7 8 / X XS MAX Double Layers Board Pre-heating Desoldering Rework Station, adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear

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