PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering

Size: 120C


PHONEFIX Heating Station + 3 kinds Motherboard Heating groove

Features : 
  1. Brand: PHONEFIX
  2. Voltage: 110V / 220V
  3. Demolition shield temperature adjustment 180℃-220℃
  4. In addition to CPU side glue temperature 180℃-220℃
  5. Demolition A8 A9 A10 A11CPU the temperature 230℃-240℃
  6. Desmearing temperature 180℃-200℃
  7. Reballing BGA chip temperature 180℃-200℃
  8. Soldering A8 A9 A10 A11 CPU temperature 190℃-210℃

Optional Types : 
  • 120X-MAX ( 3-IN-1 ) for iPhone X / XS / XS MAX Double Layers Board Pre-heating Rework Station
  • 120C - for iphone 5 6 7 8 motherboard Desoldering Rework Station
  • 120CC - Android phones motherboard Desoldering pre-Heating Rework Station

iPhone 6 6S 7 8 / X XS MAX Double Layers Board Pre-heating Desoldering Rework Station, adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear

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