PPD A8 A9 A10 Lower Upper BGA Soldering Stencils For iPhone 6 6S 7

Option: NAND 5-6P


Brand new PPD BGA reballing stencils template for iPhone 6S 6SP A7 A8 A9 A10 CPU RAM soldering repair tools, CPU NAND flash BGA stencil steel template, Upper Lower BGA reball reballing stencils planted tin mold for iPhone motherboard repair, PPD iPhone 64bit NAND / PCIE NAND flash BGA reballing stencils and Sik tin network.

PPD A8 A9 A10 Lower Upper BGA Reballing Stencils Template For iPhone 6 6P 6S 6SP 7P Logic Board Repair

[ Optional A8 A9 CPU Reball Stencil ] :
  • Option 1: A8 lower
  • Option 2: A8 upper
  • Option 3: A8 Full set
  • Option 4: A9 lower
  • Option 5: A9 upper
  • Option 6: A9 Full set
  • Option 7: iPhone NAND 4-6P
  • Option 8: iPhone NAND 6S-7P (PCIE)
  • Option 9: A10 CPU lower
  • Option 10: A10 CPU upper
  • Option 11: A10 CPU Full Set

Product Features :
  1. 100% new brand and high quality.
  2. High quality material, can work great with any universal phone repair BGA rework station.
  3. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: PPD Lower/Upper BGA Reball Stencil Mold
  • 100%: High quality
  • Color: Blue / Red
  • Unit Type: Piece

Package includes :
  • 1pcs x Lower/Upper BGA Reball Stencil

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