PPD A8 A9 A10 Lower Upper BGA Reballing Stencils Template For iPhone 6 6P 6S 6SP 7P Logic Board Repair
[ Optional A8 A9 CPU Reball Stencil ] :
- Option 1: A8 lower
- Option 2: A8 upper
- Option 3: A8 Full set
- Option 4: A9 lower
- Option 5: A9 upper
- Option 6: A9 Full set
- Option 7: iPhone NAND 4-6P
- Option 8: iPhone NAND 6S-7P (PCIE)
- Option 9: A10 CPU lower
- Option 10: A10 CPU upper
- Option 11: A10 CPU Full Set
Product Features :
- 100% new brand and high quality.
- High quality material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: PPD Lower/Upper BGA Reball Stencil Mold
- 100%: High quality
- Color: Blue / Red
- Unit Type: Piece
Package includes :
- 1pcs x Lower/Upper BGA Reball Stencil
Payment & Security
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.