2UUL Pre-cut thermal silicone pads 12X12X1.5mm Heatsink Cooling Conductive Silicone Pad for for PC Phone CPU IC repair. 100Pcs/Box Pre-Cut Thermal Silicone Pads 12x12x1.5mm for heat insulation Soldering.
1. Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface.
2. The thermal pad can lower greatly temperature and solve most of the soldering heatsink and heat insulation problem. Thermal pad are ultra soft and have good resilience. The thermal pad can be die-cut into various shapes, and easy to operate.