QCOM CPU BGA RAM Reballing Stencils Template MSM8974 MSM8274

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Price:
$2.95 $4.95

Description

QCOM CPU RAM BGA rebaling stencil template MSM8274 MSM8674 CPU soldering pins for mobile phone motherboard solder repair, BGA direct heating template 0.12mm anti drum-up reballing stencils, QCOM MSM8974 MSM8274 CPU upper lower BGA reballing stencils for mobile phone soldering repair net, multi-purpose QCOM MSM8974 MSM8274 CPU BGA reballing stencil template

QCOM MSM8974 MSM8274 CPU BGA Reballing Stencils Kit Solder Template For Mobile Phone Motherboard CPU Soldering Repair

Product Features :
  1. Amaoe Imported Japan for universal phone BGA reballing stencil template
  2. 100% new brand and high quality.
  3. Super thin thickness, just 0.12mm, easy to use.
  4. Special designed: Heat dissipating holes design.
  5. High quality steel material, can work great with any universal phone repair BGA rework station.
  6. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Material: Imported Japan steel sheet
  • Color: As pictures show
  • Type: Amaoe universal BGA reballing template
  • Thickness: 0.12mm
  • Design: Heat dissipating holes design
  • Application: For Android phone BGA reballing soldering repair
  • Unit Type: Piece
  • Suitable for: for general rework station
  • Function: for phone BGA reballing

Package includes :
  • 1pcs x BGA Reballing Stencil

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