QCOM MSM8612 CPU BGA Reballing Stencil 0.12mm Tin Planting Net

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QCOM MSM8612 MSM8210 MSM8112 MSM8212 CPU IC BGA reballing stencil template for mobile phone motherboard soldering repair, QCOM MSM8612 MSM8212 BGA multi-purpose reballing stencils with ventilation hole, QCOM MSM8612 BGA reballing stencil steel mesh tin net for cellphone CPU logic board soldering repair tools

QCOM MSM8612 MSM8212 MSM8610 MSM8112 MSM8210 CPU IC Chip BGA Reballing Stencil Template Steel Mesh Net

BGA Reballing Stencil Template with ventilation hole, it will supply the heat radiation function, with many thermal via louver, and prevent bulges and avoid hump on the BGA Reballing Stencil Template.

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