QCOM MSM8928 8926 8226 CPU IC BGA Soldering Stencil Template

Save $3

Price:
$2.95 $5.95

Description

QCOM MSM8928 8926 8226 MSM8628 8228 CPU IC BGA reballing stencil template soldering pins net for mobile phone motherboard repair, MSM8992 0.12mm CPU BGA IC chip reballing stencil template Tin steel mesh net, CPU BGA soldering stencil mesh 0.12mm BGA anti drum-up direct heating template for cellphone CPU RAM logic board welding repair tools

Amaoe MSM8928 BGA Reballing Stencil Template 0.12mm Thickness Direct Heating Mesh Net For Mobile Phone LG CPU Soldering Repair

Product Features :
  1. Amaoe Imported Japan for universal phone BGA reballing stencil template
  2. 100% new brand and high quality.
  3. Super thin thickness, just 0.12mm, easy to use.
  4. Special designed: Heat dissipating holes design.
  5. High quality steel material, can work great with any universal phone repair BGA rework station.
  6. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • 100%: High quality
  • Material: Imported Japan steel sheet
  • Color: As pictures show
  • Type: Amaoe universal BGA reballing template
  • Thickness: 0.12mm
  • Design: Heat dissipating holes design
  • Unit Type: Piece
  • Suitable for: for general rework station
  • Function: for phone BGA reballing

Package includes :
  • 1pcs x BGA Reballing Stencil Net

Payment & Security

PayPal

Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.

You may also like

Recently viewed