Amaoe QCOM MT PM MAX MT Power IC BGA Stencils Template 0.12mm Direct Heating Mesh For Mobile Phone Motherboard Soldering Repair
[Optional Types ] :
- Option 1: PM:1
- Option 2: PM:2
- Option 3: MAX:1
- Option 4: MT:1
- Option 5: MT:2
Product Features :
- 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA repair solution for cellphone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- Model: PM:1 / PM:2 / MT:1 / MT:2 / MAX:1
- Material: Imported Japan steel sheet
- Color: As pictures show
- Thickness: 0.12mm
- Design: Heat dissipating holes design
- Unit Type: Piece
- Suitable for: for general rework station
- Function: for phone BGA reballing
Package includes :
- 1pcs x BGA Reballing Stencils
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