QCOM PM MAX MT Power IC BGA Reballing Stencils Template Net

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Option: PM:1
$2.50 $4.50


Amaoe Power IC BGA reballing stencils template for QCOM MT PM MAX MT power IC repair net, MAX77833 MAX98925 MAX77836 MAX77818 MAX77803 MAX77888 power IC BGA reballing stencils net, For PM8018 PM8926 PM8996 PMI8996 PM8956 PM8941 BGA soldering stencil direct heating template 0.12mm thickness, PM8019 PM8953 power IC BGA reballing stencils steel mesh net, MT6325V MT6290MA MT6261MA MT6322 MT6329 MT6353V power IC BGA reballing stencils.

Amaoe QCOM MT PM MAX MT Power IC BGA Stencils Template 0.12mm Direct Heating Mesh For Mobile Phone Motherboard Soldering Repair

[Optional Types ] :
  • Option 1: PM:1
  • Option 2: PM:2
  • Option 3: MAX:1
  • Option 4: MT:1
  • Option 5: MT:2

Product Features :
  1. 100% new brand and high quality.
  2. Super thin thickness, just 0.12mm, easy to use.
  3. Special designed: Heat dissipating holes design.
  4. High quality steel material, can work great with any universal phone repair BGA rework station.
  5. Offer the best BGA repair solution for cellphone heating repair.

Product Specifications :
  • Item name: BGA Reballing Stencil Template
  • Model: PM:1 / PM:2 / MT:1 / MT:2 / MAX:1
  • Material: Imported Japan steel sheet
  • Color: As pictures show
  • Thickness: 0.12mm
  • Design: Heat dissipating holes design
  • Unit Type: Piece
  • Suitable for: for general rework station
  • Function: for phone BGA reballing

Package includes :
  • 1pcs x BGA Reballing Stencils

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