QianLi i2C Middle Frame Reballing Platform for iPhone X - 11 Pro Max


Price:
$26.50

Description

Qianli i2C ZX-06 6 in 1 middle frame BGA reballing platform for iPhone X - 11 Pro Max motherboard soldering repair, QianLi ZX-06 middle frame reballing platform for iPhone X XS XS MAX 11 11 Pro 11 Pro Max separating repair, QianLi 6 in 1 iPhone middle board reballing planting platform for iPhone X XS MAX 11 Pro Max logic board dissembling and assembling testing tool

Qianli i2C ZX-06 6 in 1 Mid-level (Middle) Automatic Positioning Tin Planting Platform For iPhone X - 11 Pro Max Motherboard Soldering Repair

Product Features :
  1. Anti-leakage tin barrier design
  2. High temperature does not allow drum,
  3. Strong magnetic automatic positioning
  4. Integrated, removable tin planting,
  5. Positioning slot of double-sided motherboard
  6. Support with iPhone X / XS / XS MAX motherboard, RF small board iPhone 11 / 11 Pro / 11 Pro MAX positioning tin replanting application

Product Parameters :
  • Item name: ZX-06 Reballing Middle Board
  • Brand: i2C
  • Color: Gray
  • Weight: 270g
  • Size: 101.5*52*16mm
  • Applicable models: iPhone X / XS / XS MAX / 11 Pro MAX / 11 Pro
  • Scope of application: iPhone Tin is planted in the middle of the main board

Package included :
  • 1pcs x ZX-06 Reballing Platform

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