Qianli IP-01 02 3D iPhone X 11 BGA Middle Frame Planting Tin Platform


Option: X/XS/MAX Middle Layed Stencil
Price:
$19.85

Description

QianLi ToolPlus iP-01 iP-02 Middle layer frame BGA reballing stencil platform for iPhone X XS XS MAX 1 Pro MAX motherboard repair, ToolPlus iP-01 iP-02 iPhone middle layer planting tin soldering fixture, Qianli 3D BGA reballing metal stencil motherboard middle frame planting tin reballing platform for iPhone logic board repair net fixture

QianLi ToolPlus iP-01 iP-02 BGA Reballing Platform for iPhone X-11 Pro Max Logic Board Dissembling and Assembling Testing Tool

[ Optional BGA Platform ] :
  • Option 1: QianLi ToolPlus iP-01 for iPhone X/XS/XSMax
  • Option 2: QianLi ToolPlus iP-02 for iPhone 11/11Pro/11Pro Max

Features :
  1. Durable, unique design
  2. Seiko, featured material
  3. Precise positioning
  4. Efficiency Improvement
  5. Strong magnetic attraction
  6. Stencils won't deform under high temperature
  7. High quality Phone Middle Frame Reballing Platform
  8. BGA Reballing Platform for iPhone X/XS/XS MAX/11/11 Pro/11 Pro MAX.
  9. Make your repair work easier

Specification :
  • Material: Metal
  • Color: Gray
  • Size: 99mm * 60mm * 15mm

How to use :
Step 1 : Put the mainboard into the tin-planting card slot
Step 2 : Align the corresponding tin planting mesh with the right position
Step 3 : Put the solder paste into the stencil by scraper
Step 4 : Using hot air gun to blow solder paste until it melts

Package included :
  • 1pcs x BGA Reballing Platform

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