QU2 Qualcomm BGA Stencil Template MSM8953 CPU Soldering Repair

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Qualcomm 0.12mm QU2 BGA reballing stencil template MSM8953 MSM8937 MSM8916 MSM8998 CPU soldering repair tool, Qualcomm 0.12mm thickness CPU RAM BGA reballing stencil direct heating template steel net, high quality BGA reballing stencil steel net for phone CPU RAM soldering repair, it will offer best solution for cell phone IC chip slodering repairs.

Qualcomm 0.12mm CPU BGA Reballing Stencil Template MSM8937 MSM8998 MSM8916 MSM8998 Phone CPU Motherboard Soldering Repair

MSM8916 is universal for 8929 / 8939 / 8216 / 8936 / 8239
MSM8937 is universal for 8940 / 8917

Item Specification :
  • Item Name: BGA Stencils Kit
  • Brand Name: Amaoe
  • Material: Stainless Steel
  • Color: Silver
  • Unit Type: Piece
  • Thickness: 0.12mm
  • Package Weight: 0.01kg
  • Compatible with: MSM8953 B01 / MSM8937 / MSM8998 B / MSM8953 1AB / MSM8916 / MSM8998 A

Package included :

  • 1pcs x BGA Reballing Stencil Template

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