WL Top Quality Fast Speed BGA Reballing Solder Stencils Template with Black Positioning Mold For iPhone 6 7 8 X XS NAND Baseband Soldering Repair
[ Optional Types ] :
- Option 1: iPhone 5/5S Baseband and NAND
- Option 2: iPhone 6/6P Baseband and NAND
- Option 3: iPhone 6S/6SP Baseband and NAND
- Option 4: iPhone 7/7P Baseband and NAND
- Option 5: iPhone 8/8P/X Baseband and NAND
- Option 6: iPhone XS MAX XR Baseband and NAND
Product Introduction :
Quality is very good
Magnetic base + positioning plate + tin mesh ( Together to use )
WL BGA reballing stencils kit come with black positioning mold
WL high accuracy BGA reballing stencils template for iPhone 5S 6 6P 7 8 X XS Max NAND and Baseband soldering repair
0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing solder working, it is the top quality BGA reballing stencil for iPhone CPU and NAND, for 6 6P 6S 6SP 7 7P 8 8P X XR XS XS Max
Black positioning mold with fixed plate, easy to use and more accurate CPU IC welding position.
The Black Positioning Mold just match with the right BGA Reballing Stencil.
[ Option Aluminum Mold Base ] : it is universal, can fit with any black positioning mold, ( Choose different package ), and just 1pcs aluminum mold base, easy for your working, and also save money
[ Option Positioning Mold - Black ] : Not universal, can't working with different BGA reballing stencil, need the right model BGA reballing stencil, the black positioning mold just match with the right BGA reballing stencil.
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